• Stud bumping and is the perfect solution for low volume and low cost but high performance applications like hearing aids, SAW filters, smart cards, and LCD drivers. Click to see more and call us about your stud bumping project today.
  • Shorter signal paths. Faster performance.

    Whether Flip Chip or wirebond, let Aspen Technologies’ engineering and manufacturing teams coordinate substrate design, fabrication, and assembly of your Ball Grid Arrays today. RoHS compliant. Click to see more.
  • Silicon, GaAs, InP, Sapphire, Glass, MEMS, bumped, bonded, and multi-reticle are just a few of the wafer types that Aspen Technologies’ experienced staff dices on a regular basis. From backgrind through to inspected die shipped in waffle packs, Gel Paks, or on tape, click to see more and request a quote from Aspen today.
  • Ultra fine-pitch aluminum wedge bonding at ambient temperature takes the heat off of you and your thermally sensitive devices, without sacrificing real estate or performance. Click to see more and call us to see how world-class equipment, programming, and thermally-controlled production can impact your product needs today.
  • We know that great new technology doesn’t always fit into a standard package. If you have special or advanced packaging needs, Aspen Technologies has incredible experience in packaging the unique, lowering costs, and increasing reliability!  From design through to production, choose Aspen.
  • Whether combining MEMS with ICs or stacking your memory, Aspen Technologies can get more out of your Silicon than you may have thought possible. From board, package, and process design to production, click to see more and call us to discuss your stacked-die projects today.
  • High on wire count but short on real estate?

    Aspen Technologies' cutting-edge ultra fine pitch wirebond capabilities are unsurpassed in the industry. Click to see more and call us to discuss your fine pitch wirebonding project today.
  • Faster, smaller, RoHS compliant.

    When you’re ready for Flip Chip, Aspen has the latest technologies to get you there…
    from substrate design to manufacturing. Click to see more and call us to discuss your Flip Chip projects today.