BGA Assembly
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Multi-Tiered Wirebonding
Aspen Tech Today
About Aspen TechnologiesAspen Technologies is a successful world-class advanced-packaging service provider located in Colorado Springs near the world famous Garden of the Gods National Landmark. Its mission is to enable its customers to rapidly bring new products to market through the creative application of advanced microelectronic package and assembly technologies, innovative engineering, and scalable manufacturing solutions. Aspen has a large customer base, developing and manufacturing products for many leading IC, MEMS, biomedical, start-up companies and military suppliers. Aspen has become a proven leader with an experienced engineering staff having more than 270 years of IC and MEMS experience in standard and cutting-edge microelectronic packaging technologies. Aspen Technologies is ISO 9001:2000 certified as part of its strong commitment to excellence in quality, fast time-to-market, continuous improvement, and cost reductions.
Advanced Microelectronics Packaging
Aspen Technologies assembly services include quick-turn engineering prototypes through to fully manufactured devices under SPC control. Technologies include advanced Flip Chip assembly, finest-pitch wedge and gold ball wirebonding, high-quality wafer dicing, individual die singulation, dicing of unusual materials, and much more.
Engineering & Development Services
Aspen Technologies’ Engineering & Development Services Group provides product packaging consultation, package design, fabrication sourcing facilitation, materials and assembly chemistries evaluation and selection, solves unique semiconductor packaging problems and works with Aspen’s manufacturing organization to develop unique or specialized assembly processes.
Manufacturing
Uncompromising efficiency and excellence are hallmarks of Aspen Technologies’ Manufacturing Division. Production of extremely complex devices and devices with tight Intellectual Property security requirements is done in Aspen’s Colorado facilities every day with volumes ranging from just a few to up to 50k per month. Many proprietary assembly processes have been developed, providing increased capability and product reliability. For products with greater volume needs and having significant cost constraints, Aspen Technologies can transfer the assembly processes to our offshore partner or to an offshore supplier that is best suited for the product’s requirements. Aspen’s Manufacturing Division provides unit and process control, continuous improvement, cost reductions, and fast time-to-market.
Customer Service
Aspen Technologies is proud of its reputation for outstanding Customer Service, characterized by quick response, caring communications, and integrity in all its business dealings. A defining characteristic of Aspen Technologies is its attitude of “stewardship” for its customer’s products, and this characteristic pervades all aspects of the organization.
Advanced Microelectronic Packaging Capabilities
Click here to see Aspen Technologies’ Capabilities List.
Aspen Technologies’ strength is making our customers successful, through…
Advanced Microelectronic Manufacturing
Engineering & Development Services
Quick-Turn Engineering Build Support
How can we help you be successful? Click here to contact Aspen Technologies.
