History

Aspen Technologies’ History

Aspen Technologies was spun out of Atmel Semiconductor in Colorado Springs, Colorado in 1996.  At the time, Atmel Semiconductor was doing its own first-silicon prototyping and test for its Colorado Springs wafer fabrication plant in relatively simple plastic and ceramic packages.  Needing additional floor space for test in its facilities, Atmel engaged with employee Chris Barton to start the new entity.  

Aspen Technologies became ISO certified in 1997, and continued to do prototyping for Atmel and other local semiconductor companies until 2000, when Aspen Technologies was purchased by the current ownership seeking to expand its services.  In 2001, Leland Spangler, Ph.D., a circuit designer and engineer with significant MEMS and advanced packaging experience, was hired to assist customers with their design and package engineering needs. Thus, Aspen’s Engineering & Services Group was started.  In 2004, Aspen expanded to provide process-controlled manufacturing services for MEMS and other complex devices in low volume, and has steadily increased volume manufacturing capacity and capability with continuous reinvestment in experienced personnel, the latest assembly equipment, and full Class 100 and 1000 manufacturing facilities.

Today

Aspen Technologies is a successful world-class advanced-packaging service provider located in Colorado Springs near the world famous  HYPERLINK "http://www.gardenofgods.com/home/index.cfm?flash=1" ‘Garden of the Gods’ National Landmark.  Its mission is to enable its customers to rapidly bring new products to market through the creative application of advanced microelectronic package and assembly technologies, innovative engineering, and scalable manufacturing solutions.  Aspen has a large customer base, developing and manufacturing products for many leading IC, MEMS, biomedical, start-up companies and military suppliers.  Aspen has become a proven leader with an experienced engineering staff having more than 270 years of IC and MEMS experience in standard and cutting-edge microelectronic packaging technologies.  Aspen Technologies is ISO 9001:2000 certified as part of its strong commitment to excellence in quality, fast time-to-market, continuous improvement, and cost reductions.

Advanced Microelectronics Packaging

Aspen Technologies assembly services include quick-turn engineering prototypes through to fully manufactured devices under SPC control.  Technologies include advanced Flip Chip assembly, finest-pitch wedge and gold ball wirebonding, high-quality wafer dicing, individual die singulation, dicing of unusual materials, and much more.  

Engineering & Development Services

Aspen Technologies’ Engineering & Development Services Group provides product packaging consultation, package design, fabrication sourcing facilitation, materials and assembly chemistries evaluation and selection, solves unique semiconductor packaging problems and works with Aspen’s manufacturing organization to develop unique or specialized assembly processes.

Manufacturing

Uncompromising efficiency and excellence are hallmarks of Aspen Technologies’ Manufacturing Division.  Production of extremely complex devices and devices with tight Intellectual Property security requirements is done in Aspen’s Colorado facilities every day with volumes ranging from just a few to up to 50k per month.  Many proprietary assembly processes have been developed, providing increased capability and product reliability.  For products with greater volume needs and having significant cost constraints, Aspen Technologies can transfer the assembly processes to our offshore partner or to an offshore supplier that is best suited for the product’s requirements.  Aspen’s Manufacturing Division provides unit and process control, continuous improvement, cost reductions, and fast time-to-market.

Customer Service

Aspen Technologies is proud of its reputation for outstanding Customer Service, characterized by quick response, caring communications, and integrity in all its business dealings.  A defining characteristic of Aspen Technologies is its attitude of “stewardship” for its customer’s products, and this characteristic pervades all aspects of the organization.

Advanced Microelectronic Packaging Capabilities

Click here to see Aspen Technologies’ Capabilities List.

Aspen Technologies’ strength is making our customers successful, through…

Advanced Microelectronic Manufacturing
Engineering & Development Services
Quick-Turn Engineering Build Support

How can we help you be successful?  Click here to contact Aspen Technologies.