Jack Harrison
Chief Executive Officer

Mr. Harrison became CEO of Aspen Technologies in 2000 and has led Aspen from a small prototyping facility with 11 customers in 2000 to a leading onshore microelectronic advanced packaging and engineering service provider serving more than 70 customers, having quadrupled in size during that time. Aspen Technologies now provides design, development, prototyping, and manufacturing services of high value microelectronics devices in the commercial, medical, military, and MEMS fields, and has formed several strategic partnerships. Mr. Harrison received a BME degree from Wheaton College in 1976 and has 22 years of international marketing and communications experience.

Rick Hobbs
Chief Operating Officer

Mr. Hobbs has worked with Aspen Technologies since January, 2006, and now serves as Chief Operating Officer, bringing with him 25 years of diverse operational and financial leadership experience in both services and manufacturing businesses. Rick was a co-founder and Chief Financial Officer for Alliente, a venture backed start-up that developed and executed the first successful large scale outsourcing model in the procurement BPO space. Prior to Alliente, Rick had a successful 16 year career with Hewlett Packard where his experience included senior financial positions in three manufacturing businesses, director of accounting operations for HP’s worldwide financial services organization, and global strategic sourcing director for indirect procurement. Rick holds a Master of Business Administration from Arizona State University and a Bachelor’s degree in Finance from Miami University (Ohio).

Dr. Leland 'Chip' Spangler, Ph.D.
Vice President and Director of Engineering & Development Services

Dr. Spangler received his Ph.D in electrical engineering from The University of Michigan in 1988. He joined Aspen Technologies in 2001, bringing with him more than 25 years of IC and MEMS experience at Ford Microelectronics, Intel, and other companies. At Aspen, Chip oversees all product and advanced packaging development programs in the Engineering & Development Services Department, which he directs. In his career, he has had design and engineering responsibility for a wide range of microelectronic products including analog ICs, pressure sensors, micro-machined fuel injectors, airbag accelerometers and telecom devices, many of which were qualified and manufactured in high volume. Dr. Spangler is the author of over 25 technical publications and 7 patents. He is currently an editor for the IEEE Journal of Microelectromechanical Systems (JMEMS), and he serves on the International Steering Committee for the IEEE Transducers Conference. Most recently he was the Technical Program Chair for the 2006 Solid State Sensors, Actuators and Microsystems Workshop and is the General Chair for the same conference in 2008.

Mike Cole
Aspen Technologies Manufacturing Manager

Mr. Cole has extensive experience in high-tech microelectronics/MEMS device assembly and high volume automotive component manufacturing operations following the lean manufacturing principles of the Toyota and Ford production systems. He was instrumental in starting up and managing the semiconductor and MEMS assembly operations for Ford Microelectronics (FMI) and the United Technologies Microelectronics Center (UTMC). Prior to joining Aspen Technologies, he was General Manager of Operations for a Japanese-owned tier-1/tier-2 auto parts manufacturer, operating under the Toyota Production System, supplying devices to Toyota, Nissan, Mazda, Subaru and Daimler-Chrysler. He holds a BS degree in Ceramic Materials Engineering from the University of Washington.