+ Manufacturing Services
+ Production
BGA Assembly
Ceramic Assembly
Chip-On-Board Assembly
Flip Chip Assembly
MEMS & Custom Assembly
+ Prototypes
Quick-Turn Assembly
+ Capabilities / Technologies
Wafer Backgrind
Wafer Dicing / Inspection
Wafer Solder Bumping
Die Attach & Underfill
Flip Chip
Wirebonding
Stud Bumping
Sealing (Lid / Encapsulation)
+ Additional Production Services
Die Tracing, Serialization
Inventory Management
Supplier Management
+ Custom Services
XeF
2
MEMS Release
ITAR Compliance
+ Test / F/A
Product Testing
Reliability & F/A
+ Engineering Services
Development Process
Package / Substrate Design
Material Evaluation & Selection
Engineering Studies
+ Test / F/A
Product Testing
Reliability & F/A
XeF
2
MEMS Release
+ Resources / Downloads
Capabilities List
Capabilities Presentation
UpLink!
Info Request
Data Sheets
White Papers
Mil Std 883G Download
Package Drawings
ITAR Compliance
+ Quality
Quality at Aspen Tech
ISO 9001 Certification
Quality Policy
Quality Manual
+ About Aspen
+ Contact Aspen Tech
Contact Us
UpLink!
Info Request
+ Visit Aspen Tech
Directions & Accommodations
+ About Aspen Technologies
Aspen Tech Today
Facilities
History
Management
Mission & Values
Capabilities Presentation
Capabilities List
Aspen Tech in the News
Careers
Home
ยป
Manufacturing Services
Manufacturing Services
Production
Capabilities / Technologies
Additional Production Services
Custom Services
Test / F/A
Prototypes
ITAR Compliance
BGA Assembly