BGA Assembly
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Flip Chip Assembly
Complete Turn-Key Production
Substrates:Organic, ceramic, HiTCE, flex, silicon, et alAll die sizes & configurations
Substrate design & fabrication, or
Assembly of customer-supplied substrates
High performance substrates available
Materials selection & evaluation
Low & medium volume production
Engineering prototypes in 24 hours
Reliability testing
Inventory management
ITAR Compliance available
Wafer / Die Bumping
UBM: Sputter, evaporated, electroless Ni
Solder: Pb-Free (RoHS), eutectic, high Pb, Plated, evaporated, screen print, jetting
Gold Stud Bumps
Assembly
Solder reflow
Conductive or anisotropic adhesive(Gold Stud bumps processes)
Standard & “No Flow” Underfills available
Dam & encapsulation or lid seal
Substrate Ball Attach
Pb-Free (RoHS), eutectic
All ball sizes
Marking
Custom marking
Serialization available
Wafer Dicing
Up to 300mm wafers
Die and wafer tracing available
Wafer backgrind available
Flip Chip Assembly
When you’re ready for Flip Chip, Aspen Technologies can provide you with successful implementation & rapid time to market. Aspen can assist in choosing the perfect bump technology and materials to meet your requirements, execute the substrate design, produce prototypes, manage the qualification, and manufacture your devices in its Colorado facilities (or at an off-shore partner if in sufficient volume). Flip Chip has entered the advanced packaging mainstream, and devices like microprocessors, DSPs, driver chips, smart cards, and even MEMS are taking advantage of its strengths:
- Smaller footprint
- Greater interconnect density
- Faster speeds (lower resistance, capacitance, & inductance)
- Excellent thermal management
Introduced in 1964 by IBM as the C4 process (Controlled Collapse Chip Connection), Flip Chip now offers a viable & proven alternative to standard assembly technologies for products requiring enhanced performance. Aspen Technologies has extensive experience with a wide range of Flip Chip bump & assembly methodologies, and mating them with diverse substrates: organic, ceramic, HiTCE, flex, Si on Si, and others.
Whether your device requires three bumps or 3,000, has single or multiple die, requires lead-free, eutectic, or Stud Bumps, Aspen can provide a full assembly solution for you as it has many other recognizable industry names for nearly 10 years!
