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Wafer Dicing

Multi-Recticle Dicing

Sub-Dicing

Beveled-Edge Dicing

Double Cuts

Wafer Dicing / Inspection

Out of the many critical process steps in IC and MEMS assembly, it’s usually the dicing step that strikes palatable fear into the lives of product engineers. The mere thought of “flooding my expensive, fragile wafer with water and cutting it with a diamond impregnated blade at 60,000 revs per second” can be terrifying!

With Aspen Technologies, you can relax! Aspen’s many years of experience of processing wafers daily for some of the most recognizable names in the business should put you at ease. In addition, Aspen’s investments in proven dicing and cleaning technologies, high-grade water systems, reionization, and surfactant & cooling injection systems serve to complement its strictly controlled processes and procedures; all designed to protect the performance of your die and maximize yield. In the words of one of our customers, “I trust Aspen to care for “my babies” as if they were their own!”

Whether you need hundreds of wafers processed or the die harvested from just a single multi-reticle wafer, or if you have special dicing requirements for your MEMS or biofluidic devices, there’s no better solution for your dicing and inspection needs than Aspen Technologies!

Dicing
Any wafer size, up to 300 mm
Multi-project wafers
Substrates of odd sizes
Thick to very thin wafers (< 0.005 in. / 0.127 mm)
Wide or Narrow streets (< 0.0006 in. / 15 microns)
Sub-dicing (die dicing)
SOI (bonded wafers)
Non-orthogonal or non-continuous streets
Double-cuts
Stepped-cuts
Beveled (V) cuts (for security and space apps)
Materials
Silicon, Sapphire, GaAs, Glass, Quartz,
Ceramics, Organics, Metals
Sorting
Die binning
Die tracing (to the wafer location)
Die Visual Inspection
Commercial, Mil Std, Custom

As a world-class manufacturer, Aspen Technologies understands that the dicing process and the quality of the singulated, sorted, and inspected die directly affects finished product reliability. Don’t trust your babies with anyone else!