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Wirebonding

There are few companies in the world that can match Samtec Microelectronics’ wirebonding expertise and wide-ranging experience.  
Gold ball bonding
Gold wedge bonding
Aluminum wedge bonding (at ambient temperature)
Stud bumping (Au)
Short wires (< .008”); Wedge and Ball
Long wires (> .600”)
Thin wires (.0007”)
Thick wires (to .002”; Au, Al, Pt)
Wirebonding to unusual surfaces
Bare polysilicon, platinum, paper, bare copper, etc.
Stacked die
Multi-die
Multi-tiers
Complex programs
High wire counts (7000 wire programs)
Etc.

Rather than bore you with lots of words and capabilities, we hope you’ll appreciate a few photos from Samtec Microelectronics’ Wirebonding Photo Album.  If a picture is worth a thousand words, please enjoy this conversation…

Ball Bonding Gallery / Wedge Bonding Gallery


Ball Bonding


Dual Die PBGA
Staggered Pads - 2
Multi-tiers - 5

Multi-Tiers - 4
Multi-Tiers - 3
43um pitch

Long Low Wires 2
Fine Pitch PBGA
Low Trajectory 2nd Bonds

Fine Pitch to Multi Tiers-2
Stacked Die
Staggered Pads 2

Long Low Wires
Fine Pitch to Multi Tiers
Multi-Tiers - 2

Multi-tiers - 1
Staggered Pads
Die on Interposer Test

Wedge Bonding


Au Wedge Bonding in Multi-Tiered PBGA
Short Wires on Test Device
Ambient Temp Bonding

Constant Gap Bonds
Au Wedge Bonding - PBGA
Fine Pitch PBGA

MEMS in Bathtub
Die In Corner
Fine Pitch Al Wedge Bonding

Stacked Die
Al Wedge Bonding & Flip Chip - Photonic Device
Ambient Temp Bonding - 2

8 Mil Wire Length
Au Wedge Bonding - CPGA
Long Wires

AL Wedge Bonding on Polysilicon
Al Wedge Bonding in Etched Cavity Package
51 uM Pads

Test Device Diagram
Test Device Results