XeF₂ MEMS Release

New products headed to market occasionally require adding unusual manufacturing steps to standard IC processes. Aspen Technologies has partnered with various customers to bring unique, state-of-the-art equipment into Aspen’s facilities as a part of the product development and manufacturing cycle. This is reflective of Aspen’s unusual customer-centric, development-engineering philosophy.

With strong MEMS engineering and manufacturing expertise, Aspen joined with two of its customers to add Xenon Difluoride (XeF₂) etching equipment to its process arsenal. Aspen’s engineers developed MEMS release recipes which yielded consistent and repeatable results, and both devices are in regular production at Aspen and on the market.

The Xenon Difluoride (XeF₂) process is a dry isotropic etch with high selectivity to silicon, leaving other standard films (including photoresist, silicon dioxide, silicon nitride, and aluminum) virtually untouched in the process. Though it is particularly well suited to MEMS release, it is useful for many applications where highly selective isotropic silicon etching is required.

If your company is embarking on the forefront of technology and would like to learn more about the unique advantages of Xenon Difluoride etching, please see the following brochure:

“Unique Capabilities of Xenon Difluoride for Releasing MEMS”

Brochure courtesy of Xactix, Inc.

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